LEITAT goes forward in PRINT4PACK project

PRINT4PACK project entitled Low cost integrated autonomous RF temperature sensors for food packaging. The project coordinator is CHIMIGRAF IBÉRICA SL (Catalan industry) a company focused on high quality production, distribution and sales of water, solvent and UV Inkjet based inks for Flexography, Rotogravure and Digital Systems. The partnership is composed by Zettlex (UK SME) , Plasto-sac (Israel industry), Enplater (Catalan SME) and LEITAT Technological Center (Catalan research organisation).

The objective is to develop  a new technique which can be used for low cost, radio frequency (RF) sensing. The main target is temperature sensing and logging for chilled, frozen and fresh food. The technology comprises a printed temperature sensor, printed power supplier (supercapacitor), and printed RFID antenna coupled with very low cost chips. The project also includes development of suitable polymer substrates with appropriate properties for high speed/high precision printing. The main targeted innovation is the combination of very low cost high precision high productivity gravure printing of temperature sensors, supercapacitors as energy storage devices and RFID antennas integrated to SoC IC for food packaging applications to ensure scalability for the industries.

PRINT4PACK partners during the 2nd consortium meeting at LEITAT facilities (2013-11-28)